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Surface Finishes: Pin and Barrel Since most materials oxidize readily upon exposure to the atmosphere, gold or other noble metals are often used to prevent or retard oxidation of SMT or PTH component leads or PWB solder lands and plated though-hole barrels. However, most circuit boards and component leads are covered with less noble materials such as tin (Sn) or tin-lead (Sn-Pb) and instead rely upon a fluxing agent to remove naturally occurring oxides prior to and during the soldering process. In a solder joint, the component lead and pad interface materials are wetted by and sealed in solder. The solder gives the interconnection mechanical rigidity and seals the contact surfaces from the environment. This is not the case with press-fit technology. The press-fit process is compatible with all surface finishes on the pin and the PTH barrel. The frictional properties of some materials are more favorable to the press-fit process than others. Sn-Pb is known to have favorable properties for the press-fit process. Pb is known for good tribologic properties and acts as a lubricant for the press-fit process. Copper is less favorable but is not a problem if the PWB hole is sized properly for the press-fit pin.

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Materials in Light of RoHS With the onset of the European Union s (EU) RoHS legislation, there is additional consideration for the press-fit process. The original directive banned Pb for most PWB materials and assembly. This resulted in two problems. First, press-fit connector contacts converted to Sn instead of Sn-Pb would risk Sn-whisker formation. Unlike Sn-coated SMT component leads, there is no reflow associated with press-fit technology. Without the reflow step, Sn-whisker formation is much more likely to occur. Second, increased frictional forces from Pb-removal on currently designed products made pressing difficult and in some cases resulted in damage to the PWB. EU s RoHS technical advisory committee was petitioned and an exemption to the RoHS legislation was enacted permitting the use of Pb in surface finishes for compliant pin connector systems. 1

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The Gas-Tight Seal In the case of the press-fit connector pin, there is neither a physical wetting of material nor metallic encapsulation to protect the interconnection.Additionally, no chemical fluxing agents are used.

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Instead, the press-fit pin is anchored solely by the mechanical interference between connector lead and the PTH barrel of the PWB. Oxides on the surface of the press-fit pin and mating PTH barrel are broken loose by the high frictional forces associated with the press-fit assembly operation, so nobility of materials, oxide build-ups, and material shelf-life are less critical considerations than in soldering. If conditions are proper in terms of sizing and materials, the press-fit process results in a gas-tight contact between the connector pin and the PTH barrel wall. The notion of a gas-tight seal as the product of a proper press-fit is crucial to connection reliability. If an electrical contact is to be reliable, the interface between the two mating surfaces must remain chemically and mechanically stable. The gas-tight, smeared, metal-to-metal contact attained during the press-fit operation mitigates oxidation of either contact (PTH barrel or pressfit pin) and prevents fretting corrosion, which is a common failure mechanism for mechanically mated contacts, especially those subjected to vibration. Press-fit interconnection is considered at least as reliable as a soldered connection and there is no solder joint to degrade or crack with time.

Surface finish of the PWB s PTH has a significant effect on the force required to seat a pressfit connector. Changes in surface finish and PTH finish quality can have a profound effect on pressing force and reliability.

Tribology Every material has frictional (tribologic) properties. Some are naturally lubricating, such as Sn-Pb alloys, and others are notably nonslippery, such as tin or copper. Copper is one of the least slippery of the surface finishes and typically requires more pressing force than Sn-Pb or gold finishes for a comparably sized hole. Tin s crystalline structure is also rather resistant to sliding. In some cases, extra attention to PTH finished hole size (FHS) is required. The PWB vendor should be alerted to the fact that holes are being placed in the board for press-fit, so FHS and surface finish conditions are appropriate for the press-fit component. In some cases, for some materials such as copper, the holes could be specified for the upper end of its FHS as expressed by the connector vendor to aid in insertion. FHS should be just that: the hole size after surface finish is applied. If tribologic forces are too great, then the PTH barrel can be pushed out of the board or otherwise damaged. Trial boards and pressing parameters should always be assessed before full manufacturing commences. Only very small changes or imperfections can interfere with the typically high yields of press-fit connections. As previously mentioned, recently the European Union exempted press-fit connectors from its RoHS legislation, allowing the use of Sn-Pb coatings on compliant tails. The Pb adds a small amount of lubricity, allowing for easier pressing into notably difficult surface finishes such as organic solderability preservative (OSP) copper.

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