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PTH Barrel Finish Barrel finish can have a profound impact on the press-fit operation. If a PTH barrel is too thin or poorly sized for the compliant pin, the pin may pierce the barrel wall or break internal connections to it. OSP-copper finish since it is a watery, thin topical coating adds no appreciable thickness to the PTH lands or barrel, so its control in high-aspect-ratio holes is not an issue in terms of press-fitting. Electroless/immersion surface finishes are generally thin and self-limiting in thickness, and as with OSP-copper, there no appreciable change in PTH hole diameter adding little impact to the press-fit process. At the other end of the spectrum are hot air solder leveling (HASL) and electroplated finishes, which may add significant material to PTH barrel walls and annular rings. Too thick a HASL coating can lead to PTH barrel diameter reduction. During pressing, the press-fit pins may be overcompressed, causing them to yield and collapse beneath the connector rather

MAX521 #3

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for a wider range of materials [1] The choice of the material will depend on the matching of the properties of the material with the intended application As MEMS mainly deals with thin-film materials, the properties of the thin-film materials should be considered as they may differ from the properties of the bulk material The substrate in a microsystem is a flat macroscopic object on which microfabrication processes take place It also serves as a signal transducer besides supporting other transducers that convert mechanical actions to electrical outputs In semiconductors, the substrate is a single crystal cut into slices from a larger piece known as a wafer which originates from an ingot (Figure 830) [6] However, microsystems can be made of either active substrate materials or passive substrate materials Active substrate materials are primarily used for sensors and actuators Fig 830: A silicon wafer [4] in microsystems and other MEMS components Typical substrate materials used are silicon (Si), germanium (Ge), gallium arsenide (GaAs), quartz, glasses, metals, ceramics and polymers [4] As most of the materials are semiconductors, they can function either as a conductor or an insulator when the need arises Basically, these substrate materials have a cubic crystal lattice with a tetrahedral atomic bond which gives dimensional stability and is relatively insensitive to the environment [16] Of the various substrate materials, silicon is the most dominant material as it is possible to integrate circuits with MEMS devices The single-crystal silicon is generally used because it is widely available In addition, it is mechanically stable and serves as an ideal lightweight structural material Furthermore, as it has a melting point of 1,400 C, silicon is dimensionally stable even at elevated temperatures Silicon also has a low thermal expansion coefficient With virtually no mechanical hysteresis, it is suitable for use in sensors and actuators Silicon also allows a greater flexibility in the designing and manufacturing process [6] Silicon compounds such as silicon dioxide (SiO2), silicon carbide (SiC) and silicon nitride (Si3N4) are also used in making MEMS and microsystems In polycrystalline form, silicon can also be deposited onto silicon substrates by low pressure chemical vapour deposition (CVD) technology which is suitable for surface micromachining Piezoelectric crystals are one of the most common non-semiconducting materials Generally, piezoelectric crystals are solid ceramics, and they are capable of converting mechanical energy into electronic signals and vice versa Polymers which include plastics, adhesives, Plexiglas and Lucite are also used in the manufacture of MEMS and microsystems Polymers are made up of long chains of organic molecules which are mainly composed of hydrocarbons Photoresist polymers are used to produce masks for.

FIGURE 15.4 The same PBA can have a wide range of natural resonances depending on the mounting method, which is why shock and vibration concerns are a critical design consideration.

E Modulus of elasticity (type GF epoxy-glass) m Poisson s ratio a Longer dimension of the PBA b Narrower dimension of the PBA t Thickness of the PBA W Weight of the PBA including components D= where D is the plate bending stiffness.

1.378 104 MPa 0.12 (dimensionless) 200 mm 150 mm 1.6 mm 0.25 kg Et 3 12(1 m2)

(15.4)

Microelectro-mechanical Systems (MEMS)

(15.5)

(15.6)

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